(Nanowerk Spotlight) There is a lot of buzz in the computer industry about so-called three-dimensional (3D) chips, promising higher performance with lower energy consumption, and paving the way for ...
Two major semiconductor players have unwrapped plans to ramp up production in the 0.13-µm (130-nm) CMOS process. Combining innovations in copper wiring, silicon-on-insulator (SOI) transistors, and ...
Optoelectronic components made of the semiconductor material silicon are sensitive to light with wavelengths ranging from the ultraviolet (UV), visible light, to near-infrared radiation (300-1100 nm).
A technical paper titled “A Review of the Recent Developments in the Fabrication Processes of CMOS Image Sensors for Smartphones” was published by researchers at Texas A&M University. “CMOS Image ...
Universities need to have access to technology for teaching their students who can be trained at least on the most up to date technology processes. Research Laboratories usually need to have high ...
Geneva, June 15, 2011 - STMicroelectronics (NYSE: STM) and CMP (Circuits Multi Projets®) today announced that the CMOS 28nm process from STMicroelectronics is now available for prototyping to ...
A new methodology to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. August 18th, 2021 - By: Coventor A new methodology ...
An innovative design by Motorola's Sensor Products Division in Tempe, Ariz., optimally integrates a surface-micromachined capacitive automotive tire-pressure sensor with a 0.8-µm CMOS double-metal, ...
A Grenoble, France-based research team at CEA Leti and chip maker STMicroelectronics say that they have demonstrated the first hybrid III-V/silicon laser to be fabricated using a wafer manufacturing ...
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