Anthony Paul Bellezza the inventor of a 2D Graphene fusion process being used for CMOS Chip assembly processes, that fuses interconnects at temperatures within the thermal budget of the chip below 400 ...

SAN FRANCISCO—Intel Corp. is studying optical interconnects with an eye toward replacing chip-to-chip electrical interconnects in order to overcome looming bandwidth issues as microprocessors with an ...

For decades, chipmakers have squeezed more computing power out of silicon by shrinking transistors, but that strategy is running into hard physical limits. A new approach from MIT aims to sidestep ...

It's been 20 years since IBM first introduced copper interconnects in CMOS processing, sparking a minor revolution in the process. Within a handful of years, both Intel and AMD had made the jump as ...

WEST LAFAYETTE, Ind. — Purdue University is leading a new center to overcome the challenges of critical parts needed for low-power, high-performance computer chips in consumer electronics, vehicles ...

BOISE, Idaho--(BUSINESS WIRE)--American Semiconductor, Inc. is presenting the industry’s first demonstration of a wafer scale process for high performance, flexible, single crystalline CMOS circuits ...