Aries Electronics has expanded its line of CSP (chip scale package) and MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad to include a version that ...
The company's micro BGA and CSP test and burn-in sockets can accept devices measuring up to 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both components employ ...
The company's micro BGA and CSP test and burn-in sockets can accept devices measuring 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both sockets employ solderless, ...
With the introduction of a socket that accommodates devices 13 mm² or smaller with a pitch of 0.30 mm or higher, Aries Electronics has expanded its line of CSP (chip-scale package) and MicroBGA ...
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