Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
Considerations for dividing analog and digital blocks. Decoupling techniques. Breaking down the board layers. How best to deal with grounding. Similar to building a house, it’s essential to create a ...
Printed-circuit-board (PCB) substrate material, like FR-4 glass epoxy, is a poor conductor of heat. Conversely, copper is an excellent conductor of heat. So, more copper area on a PCB is ideal from a ...
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