Electrostatic discharge (ESD) protection is critical at advanced nodes to safeguard designs against effects intensified by shrinking transistor dimensions and oxide layer thicknesses. On the other ...
Electrostatic discharge (ESD) is caused by the discharge of an excess or deficiency of electrons on one surface with respect to another surface or to ground. When a static charge is present on an ...
Electrostatic discharge (ESD) issues in integrated circuit (IC) chip designs have become more critical at advanced semiconductor process nodes, due to shrinking transistor dimensions and oxide layer ...
Advanced CMOS process technologies enable IC designers to deliver higher performing devices, but also increase the need for extra board-level ESD protection to ensure the reliability of the end ...
Fig 1. Comparison of a traditional ESD protection design methodology and the PicoGuard XS architecture shows how the latter can provide matched inductance. Fig 2. In a traditional ESD device, the ...
Whether you’re designing integrated circuits, equipment, or systems, you absolutely must provide protection from electrostatic discharge (ESD). ESD is a common problem in most environments. Product ...
•ESD protectors with low dynamic resistance won’t necessarily protect circuits. •Most damage is caused within the first nanosecond of an ESD event. •The ESD protector should set as close as possible ...
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