The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...
We may look back at 2001 as the year the age of plastic flip-chip began. After hovering in a seemingly endless holding pattern, flip-chip packaging and assembly of ICs on laminate (plastic) substrates ...
The value of chip-package codesign is well established. Complex parts with high-speed signals put more constraints on the design of both IC and package, and careful design is required to achieve ...
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