Network World

DARPA wants low-power chips that handle high-impact applications

DARPA this week announced a new program called Circuit Realization At Faster Timescales (CRAFT) that looks to radically alter and shorten the design cycle for custom integrated circuits Heavyweight 3D ...
Semiconductor Engineering

Electrothermal Mechanical Stress Reference Design Flow For Printed Circuit Boards And Electronic Packages

This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS. This approach can be ...
EDN

Synopsys Releases New Versions of RSoft Photonic Component and Optical Communication Design Tools

DSP library supports transceiver design and bit-error-rate estimation for data centers and other short-distance applications New interface with Luceda Photonic's IPKISS design framework enhances the ...
Semiconductor Engineering

Managing Complexity: Evolving Approaches To Design Rule Checking In Modern IC Design

As integrated circuit (IC) designs have grown in complexity, scale and speed requirements, design rule checking (DRC) has evolved from a routine step into a critical pillar of successful tapeouts.
Electronic Design

Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages

Learn how ANSYS simulation software can help accurately predict electromagnetic, thermal and mechanical performance of a PCB. Used for all electrical CAD types including IC packages, touch panel ...