Although small structures can be fabricated by deposition, lithography and etching, in some cases their intrinsic variability precludes their use as elements in useful arrays. Manufacture is a proper ...

Micron Corp., a longtime supporter of the microelectronic engineering program, recently donated a wafer stepper to the Kate Gleason College of Engineering. The equipment, the ASML PAS 5500/200, an ...

Research findings and signs of computer chip industry demands were the top subjects at the 40th Annual Microelectronic Engineering Conference April 8 at RIT. With indications of growth and novel ...

The technique may also be used to study adhesion between layers in photovoltaic systems and in MEMS devices. The Georgia Tech researchers first used standard microelectronic fabrication techniques to ...

This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. “With the continuous miniaturization of ...

(Nanowerk News) Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring the adhesion strength between thin films of materials used in ...

The magnetically actuated peel test developed by Georgia Tech researchers tests the stresses to which microelectronic chips are subjected. (Image courtesy of Greg Ostrowicki and Suresh Sitaraman) ...

A standard LCD 3D printer costing under 200 euros can perform microelectronic photolithography with 20-micrometer precision, enabling affordable, cleanroom-free fabrication of transistors and sensors ...

A new technique developed by researchers at Georgia Institute of Technology takes advantage of the force generated by magnetic repulsion, allowing them to measure the adhesion strength between thin ...