The PE-100 Convertible plasma system incorporates reactive ion etching and isotropic etching/cleaning technologies into a stand-alone benchtop system. The all aluminum chamber has over 240 in. 2 of ...
Plasma chemistry and etching processes form the backbone of modern semiconductor fabrication, enabling the precise patterning and removal of material layers essential to device performance. By ...
LONDON — Deep reactive ion etching of silicon is being offered as a service by QinetiQ, the spin-out from Britain's Defence Evaluation Research Agency, and as one part of a micro-electro-mechanical ...
The Phantom III RIE is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based ...
Devices being manufactured using 2xnm and smaller etch applications run an increased risk of building up surface charges that can result in plasma induced device damage (PID). The Primo iDEA ...
There are a few methods in dry etching, such as isotropic radial etching, reactive ion etching, sputter etching, and ion milling. The intricacies of each are beyond the scope of this article, and ...
In today's industries, quality inspection in semiconductor manufacturing is critical. Many traditional fault detection and diagnosis techniques have been developed to determine the existence of trends ...
The demand for accurate characterization of high aspect ratio geometries such as narrow gaps, deep trenches or deep holes arises in many technologies and industries. A variety of metrology techniques ...
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