Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...
Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...
The proportion of lightweight core materials is increasing, especially in sectors such as aerospace, transport vehicles and wind power. Processing them requires special cutting technologies to achieve ...
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