The proportion of lightweight core materials is increasing, especially in sectors such as aerospace, transport vehicles and wind power. Processing them requires special cutting technologies to achieve ...

Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...

Rattunde is introducing the new ACS + CFMcurve Integrated Sawing and Machining Center, which uses sophisticated electronics, servo motors and custom-developed software to control the saw blade during ...

Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...

Honeycomb core materials, such as aramid, aluminium, and fibreglass, are used in areas such as interiors, winglets, spoilers and many other parts in commercial and military aircraft, helicopters and ...