Hamamatsu Photonics has developed the HyperGauge thickness measurement system C17319-11, a new device designed to enhance ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...

Forge Nano’s 200 mm single-wafer, thermal atomic layer deposition (ALD) platform for compound semiconductor manufacturing to be unveiled in Taipei Tool build slots available with delivery expected in ...

Semiconductor process engineers would love to develop successful process recipes without the guesswork of repeated wafer testing. Unfortunately, developing a successful process can’t be done without ...

One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...

TSMC makes the most advanced semiconductors in the world. They are the tiny electronic “brains” that power most modern ...

The main market opportunities in the Semiconductor PVD Equipment sector lie in addressing the complex needs of scaling and material innovations while ensuring resilient and efficient manufacturing.

San Francisco —Competing industry teams are racing to develop wafer-level packaging (WLP) as front- and backend semiconductor manufacturing and assembly technologies converge in the advanced packaging ...