An innovative handheld solution for inspecting flexible packaging film can help reduce waste, rework, and recalls that result when poorly prepared substrate surfaces lead to printing or sealing ...

According to projections from Towards Packaging, the global barrier coatings for flexible packaging market is set to increase from USD 6.43 billion in 2026 to nearly USD 12.96 billion by 2034, ...

Dublin, Feb. 25, 2025 (GLOBE NEWSWIRE) -- The "Organic Substrate Packaging Material Market Analysis by Technology, Application, and Region 2025-2033" report has been added to ResearchAndMarkets.com's ...

Companies are still pursuing sustainable packaging strategies even though they’ve toned down public messaging about it, ...

Thin film electronics on flexible substrates is a rapidly evolving technology that has the potential to revolutionize various industries, including healthcare, consumer electronics, and aerospace.

BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot production line project.

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...