From the onset of the civilian nuclear era (marked by President Dwight Eisenhower’s "Atoms for Peace" speech to the United Nations in 1953), there has been a strong awareness of the importance of ...
The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...
December 12, 2011. Mentor Graphics Corp. has announced what it calls the electronic industry’s first combined technology for thermal characterization and simulation with T3Ster® hardware test products ...
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