Just before fabrication, the design flow of all integrated circuits (ICs) culminates in transistor-based, top-level simulations. Unfortunately, verifying functionality, connectivity, and performance ...

Cadence is claiming up to 3x transient simulation performance for its latest transistor-level circuit simulator, compared with its previous offering. Called Spectre FX Simulator, it is the next ...

Almost every chip being taped out today is mixed-signal in nature. In addition to increased integration of analog and RF blocks, designers are using complex power-management techniques to minimize ...

WEST LAFAYETTE, Ind. - A simulation of electrical current moving through a futuristic electronic transistor has been modeled atom-by-atom in less than 15 minutes by Purdue University researchers. The ...

Abstract— Today’s on-chip Analog/Mixed-Signal and RF (A/RF) systems have reached a limit of size and complexity where transistor-level SPICE and FastSPICE simulation approaches cannot deliver a ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--July 24, 2006--Magma(R) Design Automation Inc. (Nasdaq:LAVA), a provider of semiconductor design software, today announced the availability of FineSim(R) Pro, the ...

With gate counts and system complexity growing exponentially, new submicron technologies pose many challenges in both the design and verification domains. Nowadays, many high-performance ...

Innovations in Very Deep Sub-Micron technologies, such as the advent of three-dimensional FinFET transistor structures, have facilitated the implementation of very large embedded SRAM memories in ...

Technologies that had become specialist tools are moving back into mainstream usage; shift left is not just about doing things earlier in the flow. A few decades ago, all designers did ...

As the digital semiconductor manufacturing process moves into the FinFET era, more and more front-end-of-line (FEOL) defects are observed due to extremely small feature size and complex manufacturing ...