New York, Sept. 15, 2023 (GLOBE NEWSWIRE) -- Electronic board-level underfill and encapsulating material sales were projected to reach a value of around US$ 310.7 million by the end of 2022. The ...
Rockville, MD , Sept. 19, 2024 (GLOBE NEWSWIRE) -- As analyzed in the newly published report by Fact.MR, a market research and competitive intelligence provider, the global market for Electronic Board ...
The report provides an analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, ...
As such, the Global Electronic Board Level Underfill and Encapsulation Material Market is estimated to expand at a CAGR of 5.5% by during the forecast period of 2020-2030. Key Takeaways from ...
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, ...
The EP3RRLV is a one part epoxy that features low viscosity and rapid curing. It is designed to give superior performance for potting, encapsulation, and underfill applications with curing ...
Master bond is leading the way in semiconductor packaging with a complete line of underfill, die attach, glob top and encapsulation compounds. These systems are designed for easy processing and ...
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