Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to ...

Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...

Traco Power’s TSR 0.6WI and TSR 1WI point-of-load converters feature a wide 8:1 input range of 9 to 72 V dc. Traco Power recently announced the release of its TSR 0.6WI and TSR 1WI non-isolated ...

Part of the Spartan line of reed relays, the 9081C and 9081C1 devices are offered in SIP packages. The 9081C measures 0.2 x 0.4 x 0.1 x 0.1 in., while the 9081C1 measures 0.2 x 0.2 x 0.2 x 02. in.