Apple’s semiconductor roadmap is poised for a major breakthrough in 2026 with the introduction of the A20 Pro chip.

Apple's foldable iPhone will share the same next-generation A20 Pro chip as the iPhone 18 Pro and iPhone 18 Pro Max models ...

The new A20 Pro chip is expected to debut in Apple’s iPhone Fold and iPhone 18 Pro, delivering major performance and ...

5G chipmakers have placed a lot of attention on supporting new 5G technologies, including 5G-Advanced, satellite non-terrestrial network (NTN) connectivity, 5G fixed wireless access (FWA), and 5G Open ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

Kyocera AVX has introduced three compact and high-performance internal, on-board, multiprotocol, 2.4-GHz antennas targeting high-demand system-in-package (SiP) applications. These include 5G mobile, ...

Why co-packaged optics (CPO) are needed in high-performance computing (HPC). How IBM delivers CPO. What CPO means for HPC applications like artificial intelligence and machine learning. Providing high ...

Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart robotic computing module, the SH602HA-AP. Based on the D-Robotics Sunrise ...

IoT: By offering modules rather than standalone chips, LTSCT aims to simplify product design for customers targeting both ...